Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фотографии Производитель. Часть # Доступность Цены Количество Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
48-6501-21

48-6501-21

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

4,372 21.97
- +

RFQ

48-6501-21

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
48-6501-31

48-6501-31

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

4,133 21.97
- +

RFQ

48-6501-31

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
612-13-650-41-001000

612-13-650-41-001000

SOCKET CARRIER SLDRTL .600 50POS

Mill-Max Manufacturing Corp.

2,546 21.99
- +

RFQ

612-13-650-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-432-61-001000

115-43-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,333 21.99
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
115-43-632-61-001000

115-43-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,027 21.99
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-432-61-001000

115-93-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,136 21.99
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-632-61-001000

115-93-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,601 21.99
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
517-83-364-17-091111

517-83-364-17-091111

CONN SOCKET PGA 364POS GOLD

Preci-Dip

2,598 20.57
- +

RFQ

517-83-364-17-091111

Datasheet

Bulk 517 Active PGA 364 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-43-316-61-008000

116-43-316-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,186 22.00
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-316-61-008000

116-93-316-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,135 22.00
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-44-950-61-001000

110-44-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,121 22.01
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-99-950-61-001000

110-99-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,199 22.01
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
APA-324-G-B

APA-324-G-B

ADAPTER PLUG

Samtec Inc.

2,631 22.01
- +

RFQ

Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-624-G-B

APA-624-G-B

ADAPTER PLUG

Samtec Inc.

3,561 22.01
- +

RFQ

Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-43-314-61-001000

116-43-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,910 22.02
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-314-61-001000

116-93-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,867 22.02
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
510-93-128-13-041001

510-93-128-13-041001

SOCKET SOLDERTAIL 128-PGA

Mill-Max Manufacturing Corp.

4,608 22.04
- +

RFQ

Tube 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-43-128-13-041001

510-43-128-13-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,438 22.04
- +

RFQ

510-43-128-13-041001

Datasheet

Tube 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
42-3570-10

42-3570-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2,365 22.05
- +

RFQ

42-3570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3571-10

42-3571-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

4,515 22.05
- +

RFQ

42-3571-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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