| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-91-652-61-001000CONN IC SKT DBL |
3,765 | 21.84 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-43-320-61-003000CONN IC SKT DBL |
1,301 | 21.84 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-43-420-61-003000CONN IC SKT DBL |
2,213 | 21.84 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-320-61-003000CONN IC SKT DBL |
2,162 | 21.84 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-420-61-003000CONN IC SKT DBL |
3,172 | 21.84 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
60-9513-11HCONN IC DIP SOCKET 60POS GOLD |
4,374 | 21.84 |
RFQ |
Datasheet |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.9 (22.86mm) Row Spacing | 60 (2 x 30) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
225-PGM15001-10CONN SOCKET PGA GOLD |
3,355 | 21.84 |
RFQ |
Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
126-41-652-41-003000CONN IC SKT DBL |
2,655 | 21.84 |
RFQ |
Datasheet |
Tube | 126 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
126-41-952-41-003000CONN IC SKT DBL |
2,209 | 21.84 |
RFQ |
Datasheet |
Tube | 126 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
126-91-652-41-003000CONN IC SKT DBL |
2,082 | 21.84 |
RFQ |
Datasheet |
Tube | 126 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
126-91-952-41-003000CONN IC SKT DBL |
2,785 | 21.84 |
RFQ |
Datasheet |
Tube | 126 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
127-41-664-41-003000CONN IC SKT DBL |
2,676 | 21.84 |
RFQ |
Datasheet |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 64 (2 x 32) | 0.070 (1.78mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
127-91-664-41-003000CONN IC SKT DBL |
4,028 | 21.84 |
RFQ |
Datasheet |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 64 (2 x 32) | 0.070 (1.78mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
115-43-632-61-003000CONN IC SKT DBL |
3,110 | 21.85 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
115-93-632-61-003000CONN IC SKT DBL |
2,467 | 21.85 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
85-PGM11007-11HCONN SOCKET PGA GOLD |
2,008 | 21.86 |
RFQ |
Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
110-13-424-61-001000CONN IC SKT DBL |
1,637 | 21.89 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
510-93-032-09-041001SKT PGA SOLDRTL |
1,164 | 21.90 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 32 (9 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-032-09-041002SKT PGA SOLDRTL |
3,908 | 21.90 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 32 (9 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-032-09-041003SKT PGA SOLDRTL |
3,049 | 21.90 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 32 (9 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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