| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
03-0513-11CONN SOCKET SIP 3POS GOLD |
12,233 | 0.84 |
RFQ |
Datasheet |
Bulk | 0513 | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
05-0513-10CONN SOCKET SIP 5POS GOLD |
10,418 | 0.84 |
RFQ |
Datasheet |
Bulk | 0513 | Active | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-0518-10TCONN SOCKET SIP 6POS GOLD |
10,388 | 0.84 |
RFQ |
Datasheet |
Bulk | 518 | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-1518-10TCONN IC DIP SOCKET 6POS GOLD |
10,689 | 0.84 |
RFQ |
Datasheet |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
07-0518-10CONN SOCKET SIP 7POS GOLD |
12,281 | 0.84 |
RFQ |
Datasheet |
Bulk | 518 | Active | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
116-83-310-41-003101CONN IC DIP SOCKET 10POS GOLD |
14,339 | 0.79 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-83-314-41-117101CONN IC DIP SOCKET 14POS GOLD |
14,851 | 0.79 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
114-83-314-41-134161CONN IC DIP SOCKET 14POS GOLD |
11,239 | 0.79 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-624-41-005101CONN IC DIP SOCKET 24POS GOLD |
11,642 | 0.80 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-624-41-605101CONN IC DIP SOCKET 24POS GOLD |
14,494 | 0.80 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-308-41-008101CONN IC DIP SOCKET 8POS GOLD |
12,544 | 0.89 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-312-41-012101CONN IC DIP SOCKET 12POS GOLD |
14,239 | 0.80 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-316-41-105101CONN IC DIP SOCKET 16POS GOLD |
13,563 | 0.80 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-87-320-41-117101CONN IC DIP SOCKET 20POS GOLD |
10,097 | 0.80 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
114-87-320-41-134161CONN IC DIP SOCKET 20POS GOLD |
14,797 | 0.80 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-87-420-41-117101CONN IC DIP SOCKET 20POS GOLD |
13,695 | 0.80 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.4 (10.16mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-304-41-013101CONN IC DIP SOCKET 4POS GOLD |
14,083 | 0.83 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-210-41-008101CONN IC DIP SOCKET 10POS GOLD |
14,333 | 0.80 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-310-41-008101CONN IC DIP SOCKET 10POS GOLD |
14,414 | 0.80 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-314-31-012101CONN IC DIP SOCKET 14POS GOLD |
14,073 | 0.80 |
RFQ |
Datasheet |
Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
.jpg)