| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
614-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
10,028 | 0.30 |
RFQ |
Datasheet |
Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-304-41-003101CONN IC DIP SOCKET 4POS GOLD |
12,485 | 0.30 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
146-87-304-41-035101CONN IC DIP SOCKET 4POS GOLD |
12,340 | 0.31 |
RFQ |
Datasheet |
Bulk | 146 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
146-87-304-41-036101CONN IC DIP SOCKET 4POS GOLD |
14,246 | 0.31 |
RFQ |
Datasheet |
Bulk | 146 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-83-306-41-005101CONN IC DIP SOCKET 6POS GOLD |
14,209 | 0.33 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-83-306-41-605101CONN IC DIP SOCKET 6POS GOLD |
13,310 | 0.33 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
612-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
13,921 | 0.31 |
RFQ |
Datasheet |
Bulk | 612 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-304-41-002101CONN IC DIP SOCKET 4POS GOLD |
14,675 | 0.31 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
AW 127-21/Z-TSOCKET 21 CONTACTS SINGLE ROW |
11,616 | 0.34 |
RFQ |
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
02-0518-10CONN SOCKET SIP 2POS GOLD |
14,052 | 0.34 |
RFQ |
Datasheet |
Bulk | 518 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
02-1518-10CONN IC DIP SOCKET 2POS GOLD |
10,412 | 0.34 |
RFQ |
Datasheet |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
115-83-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
14,907 | 0.34 |
RFQ |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
|
510-87-012-05-001101CONN SOCKET PGA 12POS GOLD |
13,298 | 0.32 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 12 (5 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-87-210-41-005101CONN IC DIP SOCKET 10POS GOLD |
11,771 | 0.32 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-304-41-008101CONN IC DIP SOCKET 4POS GOLD |
13,961 | 0.32 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-306-41-105161CONN IC DIP SOCKET 6POS GOLD |
14,494 | 0.42 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-306-41-006101CONN IC DIP SOCKET 6POS GOLD |
10,585 | 0.32 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
ED028PLCZ-SM-NCONN SOCKET PLCC 28POS |
14,444 | 0.35 |
RFQ |
Datasheet |
Tube | ED | Active | PLCC | 28 (2 x 14) | 0.050 (1.27mm) | - | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | - | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
|
AW 127-22/Z-TSOCKET 22 CONTACTS SINGLE ROW |
10,467 | 0.35 |
RFQ |
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
1571994-2CONN SOCKET SIP 2POS GOLD |
14,003 | 0.35 |
RFQ |
Datasheet |
Bulk | 510 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 20.0µin (0.51µm) | Copper | Thermoplastic, Polyester |
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