| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-43-636-61-105000CONN IC SKT DBL |
2,709 | 23.53 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-636-61-105000CONN IC SKT DBL |
1,436 | 23.53 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
510-41-068-10-001001SKT PGA SOLDRTL |
2,055 | 23.54 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 68 (10 x 10) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-41-068-10-041001SKT PGA SOLDRTL |
4,964 | 23.54 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 68 (10 x 10) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-41-068-11-001001SKT PGA SOLDRTL |
1,657 | 23.54 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-41-068-11-061001SKT PGA SOLDRTL |
4,392 | 23.54 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
27-0511-11CONN SOCKET SIP 27POS GOLD |
3,992 | 23.54 |
RFQ |
Datasheet |
Bulk | 511 | Active | SIP | 27 (1 x 27) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-6508-212CONN IC DIP SOCKET 24POS GOLD |
1,782 | 23.56 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
110-43-318-61-801000CONN IC SKT DBL |
3,938 | 23.58 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-318-61-801000CONN IC SKT DBL |
1,341 | 23.58 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
117-43-316-61-105000CONN IC SKT DBL |
1,893 | 23.60 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-41-964-61-001000CONN IC SKT DBL |
4,440 | 23.61 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-91-964-61-001000CONN IC SKT DBL |
3,525 | 23.61 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-43-640-61-105000CONN IC SKT DBL |
3,303 | 23.61 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-640-61-105000CONN IC SKT DBL |
4,939 | 23.61 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
517-83-372-19-111111CONN SOCKET PGA 372POS GOLD |
1,790 | 22.25 |
RFQ |
Datasheet |
Bulk | 517 | Active | PGA | 372 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-41-069-11-061001SKT PGA SOLDRTL |
1,133 | 23.62 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 69 (11 x 11) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
20-4508-21CONN IC DIP SOCKET 20POS GOLD |
3,294 | 23.62 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.4 (10.16mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-4508-31CONN IC DIP SOCKET 20POS GOLD |
4,072 | 23.62 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.4 (10.16mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-91-069-11-061001SOCKET SOLDERTAIL 69-PGA |
1,478 | 23.62 |
RFQ |
Bulk | 510 | Active | PGA | 69 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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