Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фотографии Производитель. Часть # Доступность Цены Количество Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-43-650-41-003000

126-43-650-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,799 22.63
- +

RFQ

126-43-650-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-950-41-003000

126-43-950-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,121 22.63
- +

RFQ

126-43-950-41-003000

Datasheet

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-964-41-004000

612-41-964-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,210 22.79
- +

RFQ

612-41-964-41-004000

Datasheet

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-964-41-004000

612-91-964-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,689 22.79
- +

RFQ

612-91-964-41-004000

Datasheet

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
38-81000-610C

38-81000-610C

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

1,815 22.81
- +

RFQ

38-81000-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-81250-610C

38-81250-610C

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3,006 22.81
- +

RFQ

38-81250-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-6621-30

36-6621-30

CONN IC DIP SOCKET 36POS TIN

Aries Electronics

4,587 22.63
- +

RFQ

36-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
127-41-668-41-003000

127-41-668-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,916 22.64
- +

RFQ

127-41-668-41-003000

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 68 (2 x 34) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-668-41-003000

127-91-668-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,820 22.64
- +

RFQ

127-91-668-41-003000

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 68 (2 x 34) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-950-41-001000

116-93-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

1,353 22.66
- +

RFQ

116-93-950-41-001000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-950-41-001000

116-43-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,306 22.66
- +

RFQ

116-43-950-41-001000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-950-61-001000

110-41-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,470 22.66
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-91-950-61-001000

110-91-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,435 22.66
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
121-13-952-41-001000

121-13-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3,763 22.66
- +

RFQ

121-13-952-41-001000

Datasheet

Tube 121 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-049-07-000002

510-91-049-07-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,513 22.66
- +

RFQ

510-91-049-07-000002

Datasheet

Bulk 510 Active PGA 49 (7 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-049-07-000003

510-91-049-07-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,274 22.66
- +

RFQ

510-91-049-07-000003

Datasheet

Bulk 510 Active PGA 49 (7 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-049-07-000001

510-91-049-07-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,831 22.66
- +

RFQ

510-91-049-07-000001

Datasheet

Bulk 510 Active PGA 49 (7 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-6508-211

24-6508-211

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,335 22.66
- +

RFQ

24-6508-211

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-311

24-6508-311

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,182 22.66
- +

RFQ

24-6508-311

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-91-176-15-061002

510-91-176-15-061002

SOCKET SOLDERTAIL 176-PGA

Mill-Max Manufacturing Corp.

4,906 22.67
- +

RFQ

Tube 510 Active PGA 176 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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