| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
64-9518-11HCONN IC DIP SOCKET 64POS GOLD |
3,804 | 20.67 |
RFQ |
Datasheet |
Bulk | 518 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
116-41-964-41-008000CONN IC SKT DBL |
1,600 | 20.67 |
RFQ |
Datasheet |
Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-91-964-41-008000CONN IC SKT DBL |
3,589 | 20.67 |
RFQ |
Datasheet |
Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-43-210-61-001000CONN IC SKT DBL |
4,146 | 20.67 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-210-61-001000CONN IC SKT DBL |
4,963 | 20.67 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
550-10-149-15-063101PGA SOLDER TAIL |
3,378 | 19.43 |
RFQ |
Datasheet |
Bulk | 550 | Active | PGA | 149 (15 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
123-13-642-41-001000CONN IC DIP SOCKET 42POS GOLD |
4,999 | 20.69 |
RFQ |
Datasheet |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-43-424-61-001000CONN IC SKT DBL |
1,863 | 20.70 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-424-61-001000CONN IC SKT DBL |
1,317 | 20.70 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
40-6508-302CONN IC DIP SOCKET 40POS GOLD |
3,996 | 20.70 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
115-43-322-61-003000CONN IC SKT DBL |
3,031 | 20.70 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
115-93-322-61-003000CONN IC SKT DBL |
2,167 | 20.70 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
612-11-650-41-001000SKT CARRIER SOLDRTL |
4,742 | 20.72 |
RFQ |
Datasheet |
Tube | 612 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-068-11-061001SOCKET SOLDERTAIL 68-PGA |
4,211 | 20.72 |
RFQ |
Tube | 510 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
123-91-952-41-001000SOCKET IC OPEN 3 LVL .900 52POS |
1,830 | 20.73 |
RFQ |
Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
123-41-952-41-001000CONN IC SKT DBL |
3,516 | 20.73 |
RFQ |
Datasheet |
Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-022-05-001001SKT PGA SOLDRTL |
3,093 | 20.74 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 22 (5 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-022-05-001002SKT PGA SOLDRTL |
3,914 | 20.74 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 22 (5 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-022-05-001003SKT PGA SOLDRTL |
1,293 | 20.74 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 22 (5 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-43-320-61-605000CONN IC SKT DBL |
1,725 | 20.74 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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