| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
115-93-318-41-001000CONN IC DIP SOCKET 18POS GOLD |
7,675 | 2.51 |
RFQ |
Datasheet |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
115-43-324-41-003000CONN IC DIP SOCKET 24POS GOLD |
8,393 | 2.85 |
RFQ |
Datasheet |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
115-93-628-41-001000CONN IC DIP SOCKET 28POS GOLD |
8,940 | 3.44 |
RFQ |
Datasheet |
Tube | 115 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
123-43-318-41-001000CONN IC DIP SOCKET 18POS GOLD |
9,523 | 4.83 |
RFQ |
Datasheet |
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
14-6511-10CONN IC DIP SOCKET 14POS TIN |
5,793 | 5.25 |
RFQ |
Datasheet |
Bulk | 511 | Active | DIP, 0.6 (15.24mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
840-AG11D-ESL-LFCONN IC DIP SOCKET 40POS GOLD |
5,399 | 5.48 |
RFQ |
Datasheet |
Tube | 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-43-950-41-001000CONN IC DIP SOCKET 50POS GOLD |
9,618 | 5.75 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
22-4518-11CONN IC DIP SOCKET 22POS GOLD |
6,892 | 4.95 |
RFQ |
Datasheet |
Bulk | 518 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
ICO-628-CTTCONN IC DIP SKT .100 |
5,605 | 6.28 |
RFQ |
Tube | ICO | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | |
|
123-47-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
7,350 | 6.34 |
RFQ |
Datasheet |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
ICA-320-SGGCONN IC DIP SOCKET 20POS GOLD |
9,935 | 7.15 |
RFQ |
Datasheet |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled |
|
317-93-121-41-005000CONN SOCKET SIP 21POS GOLD |
7,625 | 7.46 |
RFQ |
Datasheet |
Tube | 317 | Active | SIP | 21 (1 x 21) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-13-324-41-801000CONN IC DIP SOCKET 24POS GOLD |
8,321 | 7.62 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
117-93-448-41-005000CONN IC DIP SOCKET 48POS GOLD |
8,730 | 7.64 |
RFQ |
Datasheet |
Tube | 117 | Active | DIP, 0.4 (10.16mm) Row Spacing | 48 (2 x 24) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
299-93-320-11-001000CONN IC DIP SOCKET 20POS GOLD |
8,689 | 7.74 |
RFQ |
Datasheet |
Tube | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
XR2C-3205CONN SOCKET SIP 32POS GOLD |
7,253 | 7.77 |
RFQ |
Datasheet |
Bulk,Box | XR2 | Active | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
123-93-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
5,200 | 8.78 |
RFQ |
Datasheet |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
D01-9933246CONN SOCKET SIP 32POS TIN |
4,575 | 10.58 |
RFQ |
Datasheet |
Bulk | D01-993 | Active | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Tin | - | Brass | Through Hole | - | Solder Cup | 0.100 (2.54mm) | Tin | - | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
TCC03DKSN-S1713CONN TRANSIST TO-262 3POS GOLD |
1,099 | 11.24 |
RFQ |
Datasheet |
Tray | - | Active | Transistor, TO-262 | 3 (Rectangular) | 0.150 (3.81mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.150 (3.81mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
80-PGM15059-10CONN SOCKET PGA GOLD |
2,772 | 16.29 |
RFQ |
Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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