| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ICS-308-TIC SOCKET, DIP, 8P 2.54MM PITCH |
12,168 | 0.18 |
RFQ |
Datasheet |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ED14DTCONN IC DIP SOCKET 14POS TIN |
14,898 | 0.19 |
RFQ |
Datasheet |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
A 08-LC-TRCONN IC DIP SOCKET 8POS TIN |
12,986 | 0.20 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
ICS-314-TIC SOCKET, DIP, 14P 2.54MM PITCH |
10,237 | 0.20 |
RFQ |
Datasheet |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ED08DTCONN IC DIP SOCKET 8POS TIN |
12,226 | 0.21 |
RFQ |
Datasheet |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICS-318-TIC SOCKET, DIP, 18P 2.54MM PITCH |
10,421 | 0.21 |
RFQ |
Datasheet |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ED18DTCONN IC DIP SOCKET 18POS TIN |
10,428 | 0.22 |
RFQ |
Datasheet |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
AR 06-HZL-TTCONN IC DIP SOCKET 6POS TIN |
10,878 | 0.23 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
ED06DTCONN IC DIP SOCKET 6POS TIN |
13,106 | 0.24 |
RFQ |
Datasheet |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICS-320-TIC SOCKET, DIP, 20P 2.54MM PITCH |
12,896 | 0.23 |
RFQ |
Datasheet |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
1-2199298-1CONN IC DIP SOCKET 6POS TIN |
10,163 | 0.26 |
RFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
ED16DTCONN IC DIP SOCKET 16POS TIN |
12,127 | 0.26 |
RFQ |
Datasheet |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICS-324-TIC SOCKET, DIP, 24P 2.54MM PITCH |
10,148 | 0.24 |
RFQ |
Datasheet |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICS-328-TIC SOCKET, DIP, 28P 2.54MM PITCH |
14,358 | 0.27 |
RFQ |
Datasheet |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
A 14-LC-TTCONN IC DIP SOCKET 14POS TIN |
11,348 | 0.28 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
A 14-LC-TRCONN IC DIP SOCKET 14POS TIN |
13,664 | 0.28 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
1-2199298-2CONN IC DIP SOCKET 8POS TIN |
14,280 | 0.28 |
RFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
1-2199298-3CONN IC DIP SOCKET 14POS TIN |
10,405 | 0.28 |
RFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
ED24DTCONN IC DIP SOCKET 24POS TIN |
14,187 | 0.28 |
RFQ |
Datasheet |
Tube | ED | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
A 16-LC-TRCONN IC DIP SOCKET 16POS TIN |
14,720 | 0.29 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
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