| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
40-6574-10CONN IC DIP SOCKET ZIF 40POS TIN |
2,076 | 20.37 |
RFQ |
Datasheet |
Tube | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
40-9513-10CONN IC DIP SOCKET 40POS GOLD |
5,870 | 8.73 |
RFQ |
Datasheet |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.9 (22.86mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
1-2324271-8LEFT SEGMEN LGA4189-5 SOCKET-P5 |
4,465 | 29.22 |
RFQ |
Datasheet |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
|
1-2324271-7RIGHT SEGMEN LGA4189-5 SOCKET-P5 |
3,098 | 29.22 |
RFQ |
Datasheet |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
2-2129710-8CONN SOCKET LGA 3647POS GOLD |
1,096 | 37.37 |
RFQ |
Datasheet |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
2-2822979-4CONN SOCKET LGA 3647POS GOLD |
3,186 | 65.76 |
RFQ |
Datasheet |
Tray | - | Active | LGA | 3647 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
260-4204-01CONN SOCKET QFN 60POS GOLD |
3,863 | 143.86 |
RFQ |
Datasheet |
Bulk | Textool™ | Active | QFN | 60 (4 x 15) | 0.016 (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.016 (0.40mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
NTE435P18SOCKET FOR 18 PIN DIP |
12,792 | 0.36 |
RFQ |
Datasheet |
Bag | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | - | - | - | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | - |
|
NTE423SOCKET-MINI-DIP 8-PIN |
13,486 | 0.46 |
RFQ |
Datasheet |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - |
|
NTE435P20IC 20 PIN DUAL INLINE |
14,056 | 0.46 |
RFQ |
Datasheet |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | - | - | - | - | Through Hole | - | Solder | 0.100 (2.54mm) | - | - | - | - |
|
NTE42928-PIN SOCKET |
14,821 | 0.55 |
RFQ |
Datasheet |
Bulk | - | Active | - | 28 (2 x 14) | - | - | - | - | Through Hole | Open Frame | Solder | - | - | - | - | - |
|
NTE409IC SOCKET 14 PIN DIP |
11,937 | 0.56 |
RFQ |
Datasheet |
Bulk | - | Active | - | 14 (2 x 7) | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - |
|
NTE42824-PIN SOCKET |
10,221 | 0.68 |
RFQ |
Datasheet |
Bulk | - | Active | - | 24 (2 x 12) | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - |
|
NTE435P6IC DUAL INLINE 6 PIN |
10,298 | 0.69 |
RFQ |
Datasheet |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | - | - | - | - | - | - | Solder | 0.100 (2.54mm) | - | - | - | - |
|
NTE430SOCKET 40 PIN |
10,825 | 0.84 |
RFQ |
Datasheet |
Bulk | - | Active | - | 40 (2 x 20) | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - |
|
NTE435K30SOCKET-30 PIN DIP .070 |
13,232 | 0.91 |
RFQ |
Datasheet |
Bulk | - | Active | DIP, 0.4 (10.16mm) Row Spacing | - | - | - | - | - | Through Hole | - | Solder | 0.070 (1.78mm) | - | - | - | - |
|
NTE416SOCKET 16PIN DIP |
13,687 | 0.56 |
RFQ |
Datasheet |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | - | - | - | - | - | Solder | 0.100 (2.54mm) | - | - | - | - |
|
NTE435K28SOCKET-28 PIN DIP .070 |
13,740 | 0.82 |
RFQ |
Datasheet |
Bulk | - | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | - | - | - | - | Through Hole | - | Solder | 0.070 (1.78mm) | - | - | - | - |
|
NTE435P42SOCKET-42 PIN DIP |
9,943 | 1.61 |
RFQ |
Datasheet |
Bulk | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | - | - | - | - | Through Hole | - | Solder | 0.100 (2.54mm) | - | - | - | - |
|
NTE421SOCKET-TO-66 PWR |
7,108 | 1.64 |
RFQ |
Datasheet |
Bulk | - | Active | Transistor, TO-66 | - | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - |
.jpg)